David K. Quinn, Jim Thorpe, PA, 321-634-2670 DavidKQuinn@aol.com
Introduction: Analog / Digital electronic Design / Power Supply / Embedded
Microcontroller Firmware. Expert Witness and excellent technical writing skills
also offered. Consultant or direct full-time positions considered (Contract to
Perm also considered). Design abilities include: Digital, Analog, Audio,
Mixed-Signal, FPGA, Battery Management Systems, Sensors, Power Electronics, Power
Supply systems (i.e. DC / DC converters), PWM Class-D, Li-ion (Lithium Cobalt) / LiFePO4 (Lithium Iron Phosphate) battery controller (Fuel Gauge) applications. This includes
knowledge of Smart Battery Applications. 25+ years of R&D
/ product development. Embedded Microcontroller firmware engineering is
offered with a hands-on approach to engineering design including, design
validation, organization, manufacturing, and documentation. Being multidisciplined, I can offer
simultaneous debug of Hardware and Firmware (Assembly / C). I have acted as
project leader, manager, liaison to production, purchasing, C.E.M.s, technical
support, and component engineer on numerous projects. Familiar
with product I/O protection, including TVS, ESD and lightning protection.
Recognized as an out-of-the-box thinker and leader who can
optimize an engineering or manufacturing operation, helping a facility maintain
its competitiveness and market dominant position.
Knowledge and Experience:
Hardware Design: (30+ years): Digital, Analog, R.F., Mixed-Signal,
Video.
Power Supply: (Single Phase / Three Phase), Inverter, Battery
Backup, Charger, Li-ion
(Lithium Ion) /
LiFePO4.
Programming: 25+ years C / Assembly: Cooperative
Multitasking / Super-loops / Round Robin / Time Dispatcher / State Machines.
Embedded Linux Knowledge: (Microchip platform) / listed as a
Microchip Design Partner.
Safety: Vital related design: Creepage / clearance / grounding /
Fail-Safe / leakage. ex: standards such as IEC 60950.
Switching
Power Supply: design (DC to DC converters /
Inverters): typically 80-90% efficient, Familiar: Mil-Std704 / Mil-Std1275D.
Board Level Design: Discrete component level, up to
high-density Digital / Analog integrated circuits.
Analog Design: Low Noise Analog, Op-Amps, Mixed Signal,
Audio (including Class-D), ASIC and Power Supply .
Digital Design: Logic families include CMOS: CD4000, LVC, 74HC,
74HCT, LVT, LVX. Bipolar: TTL / LSTTL / ECL / PECL. Detailed understanding of
timing, logic voltage thresholds, setup and hold timing employed in successful,
bug-free digital designs.
High Power Peripheral Drivers: for driving solenoids, motors, flow
controllers, flow sensors & proportional valves.
Motor Control Servo-Loop applications: Actuators using Wheatstone Bridge, Load-Cells, Resolution tracking resolver to digital
converter for angular motor position tracking.
EWIS (Enhanced Wiring Integrity System): (Electrical Wiring
Interconnection System)
Programmable Logic: CPLDs, FPGAs and ASICs with on-board mixed
signal.
Communications: SPI, I2C, RS-232, RS-422, RS-485, USB, LVDS, FSK, HART,
Ethernet, CAN, Infrared, ARINC.
Microcontrollers: ARM-STR912, Microchip PIC, MSP430, 8051 /
8052, Z80,
68xx, 68xxx, 6502, X86, 8748, 8749, T.I. TMS320 .
Sensors: Current, PIR, Infrared, Thermal, Pressure, Altitude, Proximity, Wheatstone
Bridge.
Schematic Capture: Altium, Mentor Graphics (Very Best), PADs, Orcad, Sunstone, Autocad.
EMI / EMC compliance: RF: FCC Part-15 (A&B), Mil-Std-461, Miniature
transmitter design, Microwave (during military).
Telephony and Modem: FCC part-68 (POTS / DAA), TVS (ESD,
Transient Voltage and Standard Lightning protection).
Battery Management / Fuel Gauge Design: Sealed Lead Acid, Nickel Metal Hydride,
Lithium Ion and Lithium Iron Phosphate.
Solar Power technology: Familiarity gained through research an strong interest.
Component Engineering: work closely with suppliers and
manufacturers (CEMs / BOMs), qualify samples.
Documentation: Expert Witness, Technical writing skills, Failure
Analysis, BOMs, CAD, Production, Tech. Support and Purchasing.
Laboratory Equipment: Familiar with standard Oscilloscopes,
Meters, Spectrum Analyzers, Logic Analyzers, DVMs, etc.
Military Document Guidelines: DO-254, DSCC-Military part numbers,
Mil-Std 1547 (component derating) and MIL-STD-704E.
RF: Military - Microwave Transmitters / Receivers and associated
Telemetry equipment Tropospheric Scatter, FM / AM transmitters.
PWM LED Driver Design: VASI (Visual Approach Slope Indicator)
using LEDs.
MEMs devices: Accelerometers, Gyroscopes and Geomagnetic
Sensors / SPI interface.
Simulation / Instrumentation Design Support
Software: Labview, Spice
(LTSpice), Excel.
Experience:
Consultant
Honeywell, Sep2013 Nov2013 (Consultant).
Consultant position regarding conceptual design of a 6Ghz Micropower Impulse Radar for a level sensing
application. Additionally
performed electrical PWA environmental testing using Humiseal 1B73 Conformal
Coating and Dymex 9102 sealant to provide ruggedization, able to withstand
extreme humid conditions, while still functioning electrically. Protocol:
HART (Highway Addressable Remote Transducer) Protocol / Bell 202 FSK over a /
4-20mA current loop.
Celestica Corp: Sr. Design Engineer (Consultant).
Consultant, Power Supply Design; (LiFePO4)
Lithium Iron Phosphate fuel gauge design. Circuit design; Oversight of system designs. Documentation, reliability,
component derating, safety, production and EMI / EMC. Core design responsibilities
included Fuel Gauge designs using bq78PL116 and bq3060. Management of ~1KW
power supply designs, LiFePO4 Battery Packs.
Microsun Technology: Sr. Design Engineer (Consultant).
Consultant, Military Product Design; Lithium Ion battery charger /
balancing circuitry. Circuit Design (Using Eagle) and CAD of the PWB
were required on this employ. Also included: review and oversight of all system design decisions. Reliability, component derating, safety,
communication (I2C), and EMI were involved in this design. Core Components:
CPU: MSP430F2131IPWR and GAS GAUGE: BQ20Z65-R1.
ABB: Sr. Design Engineer
(Consultant).
Consultant, Product Design included data
acquisition using current sensors, transmission of current readings to
controller PWB for a Power Switching Control System. My responsibilities on this program
included design of RS-485 differential transmission and fiber optic system,
circuit design and PWB layout. This
included review and oversight of all system design decisions. Contained three phase current detection
device. This included long term reliability, safety and EMI.
General Electric: Sr. Design
Engineer (Consultant).
High level controller PWB for a Federal
Rail Program. This program included responsibilities of all
circuitry, including reliability, communications (RS-232), safety, EMI, I/O
design and production readiness. The technologies on this program included 3
Freescale Coldfire CPUs and 2 6805 for legacy product compatibility purposes. Design
responsibilities included redesign of analog and digital circuitry on other
associated programs. PADs used for
schematic entry and PWB layout.
Yardney Technical Products
Inc. Design Engineer (Consultant).
Lithion-Ion Battery Controller - 28Volt MIL-STD-1275D Aerospace defense program. Lion Fuel Gauge design
used optical switch methodology to provide near zero discharge current,
extending battery shelf life. Design based on the TI MSP430 with Embedded C
firmware with I2C. Stress analysis performed in conformance to
Mil-Std-1547 Component Derating Guidelines.
Opto Technology, Inc: Sr.
Design Engineer (Consultant).
Microcontroller based High Powered LED
Driver / Power Supply design using PIC2431 including Embedded C firmware. Intersema MS5541C uC Emulation sensor project
was completed. Consulted with NASA on a Lithium Iron Phosphate project.
BAE Systems: Sr. Design
Engineer (Consultant).
Battery Powered Hybrid Drive Program
Design Support. Responsibilities: troubleshooting complex
analog and digital circuits interfaced and controlled by a Freescale MPC5554 MPU.
Designs included support of single phase and three phase
Power drivers and inverters. Responsible for revising designs and resolving production / design
problems; DO-254 design verification.
Products used RS-232 and CAN. Provided diagnostic support for Assembly language programming
application.
SESI Inc: Sr. Design
Engineer (Consultant).
Short term assignment; Team leader for a
small Microcontroller design project. Responsible
for the design and debug a new control board used on Ultraviolet Biological
Trigger Lidar (UBTL). Project used the TI MSP430 uC using SPI interface. Responsible for Hardware and
Embedded C Firmware on this project, which was completed in ~9 weeks.
Goodrich Corp: Sr. Design
Engineer (Contractor).
Design Support, 787 aircraft braking system design team.
Responsibilities: Implement Load-Cell circuitry using Analog
Devices AD7731 device. System
integration, provide Load-Cell readings used SPI interface for DSP / Actuator
Feedback. Responsible
for 28Volt Power Supply (Compliant to MIL-STD-1275D), Mother Board. Production Liaison for P.S. modules. ARINC
bus standards used for avionics equipment interface. Work
compliant to EWIS (Enhanced Wiring Integrity System).
Quinn Embedded Design, NASA subcontract:
Sr. Design Engineer (Contractor).
NASA Lithium Ion Battery Charger Design
Confirmation: This
short-term project involved the design confirmation and testing of a NASA
related new Lithium Battery ION Battery Charge subsystem at my facilities /
laboratory. Dissected the charger and measured critical components with
supportive documentation. Numerous tests
were performed, including battery charge / discharge cycles. Cell voltage
matching during said cycles.
General Dynamics: Sr. Design
Engineer (Contractor).
Project Leader: Redesign / Product support of classified
Mil. Spec. turret program on light armored vehicles. Nature of work was
Microcontroller, DSP,
and Power Supply controller. Also, lead team on debug effort on gyroscope
problem.
Quinn Embedded Design, Avanex: Sr. Design
Engineer (Contractor).
Production Tester Design, Project Leader: Supported design of a production tester
from concept to completion. CPUs: Microchip PIC18F8722 / USB 2.0 Co-Processor:
Microchip PIC18F2455. Circuit types
employed: 50W Adj. National Semi LM3485
based Switching Power Supply controlled by I2C from CPU interface, USB 2.0
Compliant Port, Two High-speed (230K) RS-232 ports. I/O protected by TVS devices. Wrote Embedded firmware in C for PWB test and debug. Technologies
Employed: High Speed CMOS Logic, Analog, Mixed-signal
& Switching Power Supply. Schematic
Entry: Orcad 10.3 / CAD: Pads. Spice: LTspice.
Separate FPGA project (short term) used Quartus. Project completed
Jul2005.
Quinn Embedded Design, Conexant: Sr.
Design Engineer (Contractor).
Power Supply Design / Mixed signal, Schematic Entry,
Component Selection: This
was a short term (9 week) contract job requiring Schematic entry using Orcad. I was also responsible for power supply and
mixed signal design, including general component selection. Technologies
Employed: High Speed CMOS Logic, Analog, Mixed-Signal & Switching Power
Supply. Schematic Entry: Orcad 10.2.
General Dynamics contract: Design Engineer
(Contractor).
Redesign
of Military Transmitter / Audio Unit: This mixed signal assignment required an initial analysis of a
Mil. Spec. audio board transmitter. A report was subsequently generated and was
submitted to a committee for redesign, which was approved. Some issues of this project were: Redesigned
Ground structure of unit, including R.F. Control, Analog and Digital Ground,
TVS protected I/O. Redesigned Op-Amp input structures to
decrease noise. This included logistical
placement of passive components to prevent extraneous noise pick-up. Previously
passive components were located too far away from Op-Amp inputs resulting in a
low signal to noise ratio, which I corrected. Other aspects addressed on this redesign were
related to heat dissipation, Electret microphone input circuit design, redesign
of digital potentiometer circuitry. Addressed illegal loading issues on microcontroller output ports. Schematic capture: Orcad. Design was EWIS
compliant.
Quinn Embedded Design: Sr. Design Engineer (Contractor).
Custom
Design of Infrared Detector, Project Lead / Manager: Designed Infrared Sensing product used in
a low power battery operated motion sensing unit. I specified all components,
designed all circuitry, designed the PWB, Provided BOM and worked with the
C.E.M as the unit entered its production stage.
Custom Design of Flow
Control Gas Mixing Unit: (2003) NH Sr. Design
Engineer (Contractor).
This assignment included selecting Flow
Control / Flow Sensing devices that function under Microprocessor control. Additional elements of this program included
specifying, designing and SPI based interfaces to Power drivers, A to D
converters, Closed Loop Control of gas regulation and mixing system. Components involved in the design: Pressure
sensors, Pressure controllers, Proportional Valves, DC Motors (Stepping, D.C.
and A.C. Motors) their perspective drivers.
Additionally I was responsible for the design of the Peripheral Drivers,
CPU, Peripheral Devices, Communications and Power Supply.
Unitec Electronics Inc: (2002-2003) Columbia, MD
Sr. Design Engineer (Contractor).
Custom Circuitry Design: including Microcontroller Based Analog,
Digital, Mixed Signal, Power Supply, Inverters and Lead Acid Battery Charger.
Schematic Capture used was Orcad. Performed laboratory tests to verify design
concepts, provide documentation including, BOMs, schematics, and wiring harness
diagrams. In charge of qualifying components, maintaining and organizing
component documentation for Engineering and Production.
Commercial
vending application: Designed circuitry used to control bill acceptors and coin
hoppers. Was delegated Firmware responsibilities using
Microchip PIC Microcontrollers. Firmware
is written in C using a CCS Compiler.
Designed
carrier board for a CPU, Modem, Power Supply and Power Distribution Board,
Ethernet network interface used in a type of outdoor Kiosk unit.
Responsible
for the indoor console design to interface with the aforementioned kiosk.
Responsible
for design (including schematic entry & layout, using PADs and Orcad), BOM,
and production supervision of SPI based Display I/O board, TVS protected. Designed intercom voice audio detection
circuit. TIA/EIA-644 LVDS display interface employing microstrip layout
techniques. Revised audio power
amplifier circuit. Improved power
routing on PWB.
Mars
Electronics International: (2001-2002) West Chester, PA Design Engineer (Contractor).
Circuit Design / Component Engineering. Schematic capture: Mentor Graphics. Responsibilities: Power supply, motor control
and infrared sensing circuitry design. Worked closely with purchasing and
outside manufacturer's representatives in order to qualify and acquire
components in time for projects. Design
of bill acceptor circuitry, based on 8051 CPU and T.I. TMS320 DSP. Responsible for Power Supply, Motor control, low level infrared
sensor circuit design. Oversaw laboratory experiments
for design verification. Assigned
as Component engineer for the group, this included component selection, liaison
with distributors & manufacturers, preliminary budgetary pricing and qual. testing. Oversaw installation of new
components into MRP system. This required compilation of BOMs, component
specifications and MRP documentation. Contract at MEI was extended twice, completed,
June 2002.
Analog
Devices Inc: (2000-2001) Boston, MA Sr.
Design Engineer.
Modem
design based on the
AD1803 / AD1804 chipset operating via AC-97.
Supported customers designs with audio CODECs that
operated under the AC-97 standard and supported features such as SPDIF and
TOSLINK. This program was terminated soon after I started as the result
of a legal issue between ADI and Silicon Laboratories Inc.
Infrared
of New Jersey Inc: (1998-2000) Parsippany, NJ
Sr. Design Engineer / Manager.
Electronic Design; Hardware and Firmware
for infrared sensors and communications adaptors. Some technologies
include: SPI, High speed A-D conversion,
custom RS-485 networking, Infrared networking, high
gain low drift amplifier techniques used for low level infrared sensing. Employed Medium density
FPGAs in designs. Schematics were
entered with PADs Power Logic. Oversaw PWB layout (for low noise and safety compliance). Entered Bills of Material
into corporate MRP system. Code
was written in "C" & debugged with Microchip PIC MPLab and Ice-2000
emulator. Helped in
implementation of ISO-9001. My
experience with Ethernet helped solve company networking problems.
Infrared
Positioning System: Multidimensional Infrared System. Designed Hardware, Firmware, FPGA and ran studies to verify usefulness
of such a device.
Over
Heating Sensing System: Project involved the design of Pyro-sensor
support circuitry. Design forced
electric heater to shut-down when Pyro-sensor detected a thermal rise (ignition
event / smoldering) of an object placed in front of the heater.
Infrared
Bidirectional Human Counting System: This system used multiple bipolar infrared sensors to detect and
count humans walking into and out of a large doorway field.
U.S.
Robotics / 3Com Inc: (1997-1998)
Chicago, IL Sr. Design Engineer.
T.I. TMS320 DSP based hardware design; Analog (56K / V.90) and ISDN (fractional
T1) RS-232 Modems. TAS test equipment was used to test products for
return-loss, BERT tests, noise tests, and other relevant impairment tests of
POTs based telephony products. Designs typically depended on critical analog
design practices. Designs met
requirements of international telecom impedances for compliance in several
countries. Prepared and managed PWB
layout of products. Departmental interrelations were highly dependent on
ISO-9001 registered procedures for which I was responsible. This assignment did not last long as U.S.
Robotics and 3Com merged in 1997, Large lay-offs
began. My group was sold to a Taiwanese
company.
Supervised Off-Site Compliance and Certification
testing of Several Modems: Verified
products compliance and safety certifications to UL 1950, TUV EN60950/IEC950,
FCC part-15 and FCC part-68.
ISDN Modem with ringing SLIC. Design was based on North American Ringing Subscriber Line
Interface Circuit.
Software Reconfigurable DAA: Designed and debugged a software selectable
Modem DAA for several European
countries. This allowed for a software reconfigurable MODEM that would be compliant in
several countries.
Hardware design of
(33K/V.34) Analog Modems. Designs met Part 15-B & 68 and met
EN60950/IEC950 requirements for safety compliance. TAS telecommunications test equipment was
used return-loss, BERT tests, Noise, tests.
I was responsible for hardware design and all aspects of products'
firmware. Products contained transient voltage, ESD and lighting protection. Code was written in Assembly Language,
Processors: 8051 and Rockwell cores. I also designed a 33.6K High-End Modem
which was feature loaded. Contained audio interface with the computer, logarithmic bar graph
that indicated audio levels and Download / Upload Speeds.
Additionally was responsible for product cost reduction on several
occasions.
U.S. and International POTs 33K / V.34
Modem Design. Products met FCC Part 15-B & 68. Modem
DAAs contained TVSs, ESD and lighting protection. Also
designed networking and serial/parallel port products. I was responsible or hardware design and all
aspects products' firmware. Code: written
in Assembly Language. Processors: 8051
and 6502 cores. Assisted in other products and groups when
requested.
Modems Designed: 14.4
KBPS U.S. 14.4 KBPS Japanese Int. & Ext., 14.4 KBPS German, 2400 / 9600 KBPS U.S. Quad RS-232 Expansion Port
Military: (1971-1975)
Air Force Staff Sergeant.
Achieved rank of Staff Sergeant; Specialized in electronics, maintenance
and repair of R.F.
equipment including: Tropospheric Scatter and Microwave Transmitters and
Receivers and associated telemetry equipment.
Held a Secret Security Clearance, and Honorably
discharged in 1975.
Education:
Additional Information Above and Beyond Work Experience Listed
Above:
My strongest areas are both Hardware (Embedded Microcontroller /
Analog / Digital / Mixed-Signal) and Embedded Software Engineering. I have been the sole author of many products,
in which I have been responsible for all Hardware, Firmware, EMI,
safety certifications, BOMs and production documentation. Strongest languages are: Assembly and
C.
CPU Experience: ARM,
8051, Microchip PIC, T.I. MSP430x, 6502, 6800 family, knowledge of the
Motorola 68K, X86 chips, and Rockwell (now Conexant) and TMS320 DSP Modem
Chip-Sets.
Operating Systems: Knowledgeable and skilled with Windows (95
/ 98 / NT / ME / 2000 / XP / Vista / Windows 7) and DOS and most Windows
standard applications such as Word, Excel, Outlook and PowerPoint, etc.
Audio Designs: Experienced in high quality audio designs
used in applications such as Live Professional Broadcast or Broadcast
Automation Equipment. This includes low
distortion circuitry, Class-D PWM Amplifiers. Design experience to the Op-Amp and
discrete level. I am familiar with Low-Noise audio
preamplifiers for microphones. This includes design and installations where knowledge
of shielded / balanced audio lines feeding differential circuitry providing
high performance audio over long hauls with no distortion, noise, or 60 Hz hum
problems. Im familiar with Micro-phonic
problems associated with ceramic capacitors.
I have design experience in AtoD and DtoA converters, using both
External and Embedded devices.
Power Supply: I offer solid understanding of analog and
switching power supply design. I am
aware of how a switching power supply can impact high sensitivity circuitry and
the measures necessary to keep noise to a minimum. I have designed switching power supplies with over 90+% efficiency.
Ive also been involved with Power-Supply control where high electrical
noise environments could mandate Optical coupled, SPI, LVDS, RS485, etc. for
high reliability applications. Im also familiar with Mil-Std 704.
Low Power Designs: I have designed several ultra low current
battery powered designs. Strategies for
low power design included event driven Microcontrollers where the CPU was taken
out of a deep sleep mode momentarily to service interrupts. Additional low power design experience
include: low quiescent current
regulators, low power Op-Amps and Comparators, Experience with CD4000 series
CMOS logic. Also, knowledge and
experience of MOSFET discrete design approaches which included biasing these
devices in a static mode where there is virtually no wasted energy.
Schematic Capture (CAD): Experienced with Schematic software. The more notably ones include: Pads Power Logic,
Orcad and Mentor Graphics (Verybest) Schematic Capture. Occasionally Ive designed PWBs myself when
resources were not available.
Test Equipment: Familiar with laboratory test equipment
including, but not limited to: Oscilloscopes, Meters, Spectrum Analyzers, Logic
Analyzers, Signal
Generators and Telecommunications Test Equipment (TAS).
Telephony: I have a solid understanding of POTs
Telecommunications. I have designed
Modems with SLICs (Subscriber Line Interface Circuits) complying with both
North American and International Standards.
I also have a solid understanding and experience with Modem &
telephone DAA design strategies. This includes complex impedance issues and
D.C. current specifications. Many of my
products designed over the years have been certified to both FCC Part 15 &
68 standards.
Networking: Solid understanding of Ethernet networking (802.3x), and
protocols, including HDLC. This includes
infrastructure wiring, impedance and cabling issues such as using UTP(Unshielded Twisted Pair) verses using STP(Shielded
Twisted Pair). Familiar with some protocols including Forward
error correction, CRCs, Checksums, and longitudinal parity. Familiar with
Power-Over-Ethernet (POE). Also
posses good design knowledge of USB 2.0 OTG (AKA: USB 2.0 Rev. 1a)
Flow Control: I am familiar with Flow Control Devices
including Flow Sensors, Flow Meters, Flow Controllers, and Pressure
Sensors. These included units that
interface via SPI, I2C, 0-5VDC, and 4-20 MA.
ISO9000: Familiar with ISO9000 general procedures
and establishing ISO documentation.
Documentation: Expert Witness, Familiar with
documentation (BOMs and assembly procedures), building relations with outside
contract manufacturers and distributors.
I understand the critical nature of documentation and the impacts final
end product. I am familiar with the
relationship between the O.E.M., the component distributor, and the contract
assembly manufacturer and have been in charge of this process on occasions.
References: Available
upon request.